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Gigabyte MD72-HB3
P/N: 9MD72HB3MR-00
1 141€ (inc. VAT (Spain))
Delivery is made within 3-7 days
This is an estimated timeframe. Delivery times may vary depending on logistics and stock availability.
Warranty 2 year
The product is covered by the manufacturer’s standard warranty.
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Gigabyte MD72-HB3 workstation motherboard with fast EU delivery and worldwide shipping. Best price in the European Union. Includes official warranty.
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Technical Specifications Product
| Weight | 3,2 kg |
|---|---|
| Dimensions | 44 × 35 × 9 cm |
| Country of manufacture | China, Taiwan |
| Manufacturer's warranty (years) | 1 |
| Model | MD72-HB3 |
| Memory type | DDR4 LRDIMM, DDR4 RDIMM |
| Maximum memory capacity | 4TB |
| Processors on a motherboard | 2 |
| Length (cm) | 44 |
| Width (cm) | 35 |
| Weight (kg) | 3.2 |
| Socket | LGA 4189 |
| Chipset | Intel C621A |
| Max Supported CPU TDP (W) | 270 |
| Number of DIMM Slots | 16 |
| Number of LAN Ports | 2 |
| Integrated LAN Controller | 2x 1Gb/s (Intel I210-AT) |
| Form Factor | E-ATX |
| Integrated RAID Controller | ASPEED AST2600 |
Product description
Gigabyte MD72-HB3: A Dual-Socket SP5 Powerhouse for the EPYC 9004 Era
The Gigabyte MD72-HB3 represents the pinnacle of high-performance computing infrastructure. Designed as a flagship E-ATX platform, it is engineered to unlock the raw potential of the AMD EPYC 9004 Series (“Genoa” and “Genoa-X”). This motherboard serves as a strategic foundation for next-generation data centers, offering the massive core density and I/O throughput required for cloud-native environments, hyper-converged infrastructure, and advanced AI analytics.
By synergizing the Zen 4 architecture with the blistering speeds of DDR5 memory and the bandwidth of PCIe Gen 5.0, this solution eliminates legacy bottlenecks. With integrated Dual 10GbE networking and enterprise-grade IPMI 2.0 management, it is built to deliver reliability and scalability for mission-critical 24/7 operations.
Unleashing the Power of Dual AMD EPYC 9004 CPUs
At the heart of the board lie two Socket SP5 interfaces, meticulously designed to accommodate the latest AMD processors. This configuration allows system architects to deploy up to 192 physical cores and 384 threads within a single node.
The platform is validated to sustain processors with a Thermal Design Power (TDP) of up to 400W per socket. This ensures stability even when utilizing top-tier models like the EPYC 9654, enabling the system to fully leverage 128 PCIe 5.0 lanes for unparalleled parallel processing in HPC and rendering tasks.
Revolutionary Bandwidth: DDR5 and 12-Channel Architecture
Memory bandwidth is often the deciding factor in server performance. The MD72-HB3 addresses this with a massive 24-slot DIMM array (12 per CPU). This layout takes full advantage of AMD’s 12-channel memory controller, supporting DDR5 ECC RDIMM and 3DS RDIMM modules running at frequencies up to 4800 MHz.
With a maximum capacity of 6TB, this architecture provides the massive memory footprint needed for in-memory databases and complex scientific simulations, while ECC technology ensures data integrity is maintained around the clock.
A Future-Proof PCIe 5.0 Ecosystem
The motherboard is built to handle the peripherals of tomorrow. It features a comprehensive PCI Express 5.0 interface, which doubles the data transfer rates of the previous generation. The expansion layout is versatile:
- 6 x PCIe 5.0 x16 Slots: Providing maximum bandwidth for multi-GPU clusters and FPGA accelerators.
- 2 x OCP 3.0 Mezzanine Slots (Gen5 x8): Designed for seamless integration of high-speed network cards without occupying standard riser slots.
- NVMe Optimization: The board supports PCIe 5.0 NVMe storage via M.2 and MCIO interfaces, delivering ultra-low latency I/O that is critical for real-time data processing and containerized workloads.
Enterprise Connectivity and “Lights-Out” Management
Connectivity is delivered via two onboard 10-Gigabit Ethernet ports (Intel X710-AT2), ensuring rapid data transfer for virtualization and storage networks right out of the box.
For system administration, the board integrates the advanced ASPEED AST2600 BMC. This controller facilitates complete IPMI 2.0 remote management. IT teams can utilize the HTML5 Web Console and Redfish API to monitor thermal health, update firmware, and manage power states remotely, significantly reducing operational overhead.
Server-Grade Thermal and Power Design
Reliability is baked into the hardware design. The MD72-HB3 utilizes a robust 12+ phase VRM power delivery system capable of feeding high-wattage CPUs with clean, stable power. Thermal management is handled by Gigabyte’s Smart Fan Control, which dynamically adjusts the cooling profile of the server to balance thermal dissipation with energy efficiency.
Key Interface Overview
- Networking: 2 x 10GbE Base-T (Intel X710-AT2) + Dedicated Management LAN.
- Management: ASPEED AST2600 BMC with KVM-over-LAN and HTML5 support.
- Storage: 2 x M.2 (PCIe 5.0 x4), 8 x SATA 6Gb/s ports.
- Expansion: 6 x full-width PCIe 5.0 x16 slots, 2 x OCP 3.0 Gen5 slots.
- I/O: 4 x USB 3.2 Gen2, VGA, TPM header.
Target Use Cases
- Hyper-Converged Infrastructure (HCI): Perfect for VMware vSAN or Nutanix deployments requiring high core counts and NVMe speed.
- AI & Machine Learning: The PCIe 5.0 bandwidth prevents bottlenecks when training models on multiple GPUs.
- High-Performance Computing (HPC): Ideal for fluid dynamics and structural analysis simulations.
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Overview and Analysis of the Gigabyte MD72-HB3 Motherboard
The Gigabyte MD72-HB3 is an uncompromising dual-socket E-ATX server motherboard designed to extract maximum computing power from 3rd Generation Intel Xeon Scalable processors (Ice Lake architecture) on the LGA 4189 socket. The platform relies on the robust enterprise-grade Intel C621A chipset and offers extreme compute density, a perfectly balanced memory subsystem architecture, and the highest fault tolerance for continuous operation in data centers.
This motherboard is hardware-optimized and intended for the following resource-intensive tasks:
- Large-scale enterprise virtualization: The presence of two processor sockets and support for gigantic amounts of RAM (up to 4 TB) allow for deploying hundreds of isolated virtual machines on a single physical server without performance issues.
- High-Performance Computing (HPC): A powerful power delivery subsystem capable of stably supplying two processors with a 270W TDP guarantees ultimate output in cluster computing, scientific modeling, and parallel calculations.
- Analytics and In-Memory Databases: The balanced 16-channel memory architecture provides maximum bandwidth for instant access to colossal datasets.
- Software-Defined Storage (SDS): The doubled number of PCIe 4.0 lanes from the two processors provides the broadest capabilities for connecting ultra-fast NVMe drives and high-performance hardware RAID controllers.
Comparative Table of Technical Specifications
Below is a comparison of the Gigabyte MD72-HB3 with its closest competitors on the Intel C621A chipset (LGA 4189 platform).
| Model | Form Factor | Max Processors | Chipset | Memory Type | Max RAM* | LAN Ports | TDP (W) |
|---|---|---|---|---|---|---|---|
| Gigabyte MD72-HB3 | E-ATX | 2 | Intel C621A | 16x DDR4 LRDIMM/RDIMM | 4TB | 2x 1Gb/s | 270 |
| Supermicro X12DPI-N6 | E-ATX | 2 | Intel C621A | 18x DDR4 LRDIMM/RDIMM | 4TB | 2x 1Gb/s | 270 |
| Supermicro X12SPA-TF | E-ATX | 1 | Intel C621A | 16x DDR4 LRDIMM/RDIMM | 4TB | 1x 1Gb/s 1x 10Gb/s |
270 |
| Gigabyte MU72-SU0 | ATX | 1 | Intel C621A | 8x DDR4 LRDIMM/RDIMM | 2TB | 2x 1Gb/s | 270 |
*RAM — Random Access Memory.
Analysis of Gigabyte MD72-HB3 Strengths
Based on the dry technical specifications, we can highlight the key advantages of the Gigabyte MD72-HB3 compared to competing solutions on the LGA 4189 socket:
- Perfectly balanced memory architecture: 3rd Generation Intel Xeon processors have 8 memory channels. The Gigabyte MD72-HB3 is equipped with exactly 16 slots (8 per processor), providing an ideal 1 DPC (one DIMM per channel) configuration. This allows achieving maximum stable RAM bandwidth without reducing operating frequencies, unlike the asymmetrical 18-slot solution of the dual-socket competitor Supermicro X12DPI-N6, where populating the extra slots can lead to a drop in memory speed.
- Doubled compute density: Unlike single-socket models (Gigabyte MU72-SU0 and Supermicro X12SPA-TF), the MD72-HB3 board supports the simultaneous installation of two flagship chips with a TDP of up to 270W each. This doubles the physical number of compute cores and radically increases the overall system bandwidth for heavy multi-threaded infrastructures.
- Uncompromising cooling and power delivery (E-ATX): Accommodating two ultra-powerful 270W processors requires flawless circuit design. The use of the spacious E-ATX form factor guarantees the proper distribution of components and the efficient passage of airflow within the server chassis. Both processors can operate at peak frequencies (Turbo Boost) 24/7 without the slightest risk of overheating or throttling.
- Pragmatic enterprise network: The presence of two basic 1Gb/s ports is a recognized “golden standard” for secure server management and basic service traffic. The board does not impose built-in expensive network interfaces, leaving a vast number of free PCIe 4.0 lanes for installing exactly those network adapters (10, 25, 40, or 100 Gbps) dictated by the architecture of a specific data center.
Conclusion
The Gigabyte MD72-HB3 is a reference dual-socket platform for the LGA 4189 socket, created for projects that require absolute computing power and maximum stability. Its main technical triumph is the perfectly balanced 16-slot RAM subsystem, which allows extracting 100% of the bandwidth from the Intel Ice Lake architecture without speed compromises. Combined with support for two 270W processors and a spacious E-ATX design, this motherboard serves as an ideal foundation for building the most powerful virtualization nodes, heavy database servers, and enterprise-class high-performance computing (HPC) systems.
Product FAQ
The board is equipped with two LGA 4189 sockets and is based on the Intel C621A server chipset. It is designed for powerful 3rd Generation Intel Xeon Scalable processors. The robust power delivery subsystem guarantees the stable operation of top-tier models with a Thermal Design Power (TDP) of up to 270W per processor, which is critical for resource-intensive tasks like rendering or machine learning.
The board’s architecture offers a perfectly balanced configuration: 16 DIMM slots (8 per processor). This allows you to install up to 4 TB of DDR4 server memory (RDIMM/LRDIMM). This layout ensures the allocation of one memory module per processor memory channel, guaranteeing maximum bandwidth without speed loss for virtualization servers (VDI) and In-Memory databases.
Yes, the motherboard will start and operate with a single installed processor (in the primary socket). However, keep in mind that in this mode, you will only have access to half of the RAM slots (8 slots) and only those PCIe bus lanes that are hardware-linked to the first processor.
The Gigabyte MD72-HB3 is built in the larger E-ATX server form factor (305 x 330 mm). Building with it will require a spacious server chassis (Rackmount or Tower) that officially supports the installation of E-ATX motherboards and has enough room to accommodate massive components.
Two reliable Gigabit ports (2x 1GbE RJ45) are integrated on the rear panel. This is a classic enterprise solution for basic routing and management traffic. The board does not impose built-in expensive controllers, leaving PCIe slots available for installing the exact high-speed network adapters (10, 25, or 100 Gbps) required by your specific network architecture.
Yes, the platform features a doubled number of PCI Express 4.0 lanes from the two processors. This provides the broadest capabilities for directly connecting ultra-fast NVMe drives and powerful hardware RAID controllers, eliminating any bottlenecks when processing large datasets.
The board is equipped with an integrated Baseboard Management Controller (BMC) based on the ASPEED AST2600 chip. Through a dedicated network port (Management LAN), a system administrator can remotely control power, update the BIOS, monitor all system sensors, and manage the server via a virtual console (KVM-over-IP).
Installing two flagship chips with a TDP of up to 270W each requires a serious approach to heat dissipation (a total of 540W from the processors alone). Specialized server heatsinks strictly compatible with the LGA 4189 socket will be required, and the server chassis itself must be equipped with a block of high-RPM fans to create a powerful, direct-through airflow.
The Gigabyte MD72-HB3 is a reference foundation for building heavy enterprise infrastructures. It excels at large-scale virtualization, High-Performance Computing (HPC), Deep Learning, as well as creating ultra-reliable data storage nodes and render farms.
Payment & Shipping methods
Fast and reliable delivery across the European Union
Estimated transit time: 3–7 days from order confirmation. Worldwide shipping is available for customers outside the EU.
All orders are processed within 24 hours after confirmation. Tracking information is provided as soon as the parcel leaves our logistics center.
Multiple Secure Payment Methods
We accept: Visa, MasterCard, PayPal, Bank Transfer, Klarna, Stripe, Revolut Pay, Google Pay, Apple Pay, and USDT (TRC20) cryptocurrency payments.
All transactions are encrypted and processed via certified payment gateways for your security.
Additional Notes
- Delivery times may vary depending on customs clearance and carrier schedules.
- Large or custom-built items may require additional handling time.
- Shipments are insured until delivered to the customer.
- We do not deliver to P.O. boxes or military addresses.
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Request price for products
Please submit a request, and we will gladly extend discounts on the pricing of our product sets.
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Request price for products
Please submit a request, and we will gladly extend discounts on the pricing of our product sets.
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