Supermicro X14DBI-T

P/N: MBD-X14DBI-T

1 070 (excl. TAX)

1284 € RRP en Supermicro.com

  • Delivery is made within 3-7 days

  • Warranty 1 year

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Supermicro

Supermicro X14DBI-T workstation motherboard with fast EU delivery and worldwide shipping. Best price in the European Union. Includes official warranty.

Categories: Motherboards

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Technical Specifications Product

Weight 3,2 kg
Dimensions 44 × 35 × 9 cm
Country of manufacture

China, Taiwan

Manufacturer's warranty (years)

1

Model

X14DBI-T

Memory type

DDR5 RDIMM, DDR5/MRDIMM

Maximum memory capacity

1TB, 4TB

Processors on a motherboard

2

Length (cm)

44

Width (cm)

35

Weight (kg)

3.2

Socket

LGA 4710

Chipset

System on Chip

Max Supported CPU TDP (W)

350

Number of DIMM Slots

16

Number of LAN Ports

2

Integrated LAN Controller

2x 10Gb/s (Broadcom BCM57416)

Form Factor

E-ATX

Integrated RAID Controller

ASPEED AST2600

Product description

Supermicro X14DBI-T – Dual-Processor Xeon 6 Platform with Integrated 10GBASE-T and PCIe Gen5 Architecture

The Supermicro X14DBI-T establishes a robust foundation for next-generation enterprise infrastructure, engineered to fully leverage the parallel computing power of dual Intel Xeon 6 processors. Built upon the expansive E-ATX standard (12.1″ x 13.1″), this motherboard is designed to support the rigorous demands of modern data centers. It bridges the gap between high-density virtualization and raw computational speed, utilizing the LGA-4710 (Socket E2) interface to deliver a future-proof platform for private clouds, hyper-converged storage, and mission-critical database clusters.

Scalable Multi-Socket Performance

At the heart of the system lies a dual-socket architecture capable of driving the diverse range of Intel Xeon 6 silicon. Whether configured with “Sierra Forest” (E-cores) for maximum thread density or “Granite Rapids” (P-cores) for peak single-thread performance, the platform ensures stability under heavy load. The robust power delivery system is rated to handle Thermal Design Power (TDP) envelopes of up to 350W per CPU, allowing system architects to deploy flagship processors without thermal throttling concerns.

Next-Gen Memory Throughput: MRDIMM Ready

To eliminate bottlenecks in data-intensive applications, the X14DBI-T incorporates a high-bandwidth memory subsystem featuring 16 DIMM slots. It distinguishes itself by supporting cutting-edge Multiplexed Rank DIMM (MRDIMM) technology, enabling transfer rates to soar up to 8000 MT/s (up to 1TB total) when paired with compatible P-core CPUs. For environments prioritizing capacity, such as large-scale virtualization, it accommodates standard DDR5 ECC RDIMM/3DS modules running at 6400 MT/s, scaling up to 4TB of total system memory.

Comprehensive PCIe 5.0 Ecosystem

The input/output landscape is built entirely around the PCIe Gen5 standard, providing double the bandwidth of previous generations for peripherals and accelerators.

  • Expansion Capabilities: The layout includes four physical PCIe 5.0 x16 slots and two PCIe 5.0 x8 slots, offering ample lanes for multiple GPUs, FPGA units, or high-speed RAID controllers.
  • Direct-Attached NVMe: Three onboard MCIO headers (PCIe 5.0 x8) allow for the cabling of NVMe drives directly to the CPU, reducing signal latency and simplifying cable management for all-flash arrays.
  • Internal Storage: Two M.2 Gen5 x4 slots provide a dedicated high-speed tier for operating systems or caching layers.

Enterprise Connectivity and Management

Unlike standard server boards that rely on basic gigabit links, the X14DBI-T integrates an enterprise-class Broadcom BCM57416 controller. This provides dual 10GBASE-T ports directly on the rear panel, ensuring rapid uplink speeds to core switches without occupying valuable PCIe slots. Remote fleet supervision is handled by the ASPEED AST2600 BMC, which delivers full IPMI 2.0 functionality, KVM-over-IP, and hardware-level security via an onboard TPM 2.0 module.

Optimized Deployment Scenarios

  • High-Density Virtualization Nodes: Leveraging dual sockets and massive memory capacity for efficient VM hosting.
  • Software-Defined Storage (SDS): Utilizing MCIO headers and 10GbE for fast data replication and ingestion.
  • Scientific Simulation: Harnessing the ultra-low latency of MRDIMM technology for complex calculations.

Technical Specifications Summary

  • Processor Interface: Dual Socket LGA-4710 / Intel Xeon 6 Series (Up to 350W TDP)
  • Memory Architecture: 16 Slots, DDR5 MRDIMM (8000 MT/s) & RDIMM Support
  • Expansion Slots: 4x PCIe Gen5 x16 + 2x PCIe Gen5 x8
  • Storage I/O: 3x MCIO (NVMe Gen5), 10x SATA 6Gb/s, 2x M.2 Gen5
  • Network Interface: 2x 10GbE (Broadcom) + Dedicated IPMI LAN
  • Form Factor: E-ATX (12.1″ x 13.1″)

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Payment & Shipping methods

Fast and reliable delivery across the European Union
Estimated transit time: 14–21 days from order confirmation. Worldwide shipping is available for customers outside the EU.
All orders are processed within 24 hours after confirmation. Tracking information is provided as soon as the parcel leaves our logistics center.

Multiple Secure Payment Methods
We accept: Visa, MasterCard, PayPal, Bank Transfer, Klarna, Stripe, Revolut Pay, Google Pay, Apple Pay, and USDT (TRC20) cryptocurrency payments.
All transactions are encrypted and processed via certified payment gateways for your security.

Additional Notes

  • Delivery times may vary depending on customs clearance and carrier schedules.
  • Large or custom-built items may require additional handling time.
  • Shipments are insured until delivered to the customer.
  • We do not deliver to P.O. boxes or military addresses.

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