Supermicro X14SBI-F

P/N: MBD-X14SBI-F

722 (excl. TAX)

866 € RRP en Supermicro.com

  • Delivery is made within 3-7 days

  • Warranty 1 year

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Supermicro

Supermicro X14SBI-F workstation motherboard with fast EU delivery and worldwide shipping. Best price in the European Union. Includes official warranty.

Categories: Motherboards

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Technical Specifications Product

Weight 1,8 kg
Dimensions 34 × 34 × 8 cm
Country of manufacture

China, Taiwan

Manufacturer's warranty (years)

1

Model

X14SBI-F

Memory type

DDR5 RDIMM, DDR5/MRDIMM

Maximum memory capacity

512GB, 2TB

Processors on a motherboard

1

Length (cm)

34

Width (cm)

34

Weight (kg)

1.8

Socket

LGA 4710

Chipset

System on Chip

Max Supported CPU TDP (W)

350

Number of DIMM Slots

8

Number of LAN Ports

2

Integrated LAN Controller

2x 1Gb/s (Intel I210-AT)

Form Factor

ATX

Integrated RAID Controller

ASPEED AST2600

Product description

Supermicro X14SBI-F – Compact LGA-4710 Solution for Intel Xeon 6 with MRDIMM and MCIO Connectivity

The Supermicro X14SBI-F establishes a new standard for high-density server infrastructure. Designed around the Intel Xeon 6 architecture (formerly Sierra Forest and Granite Rapids), this motherboard utilizes a streamlined 12.3″ x 10.5″ footprint to deliver enterprise-grade performance in space-constrained environments. It is specifically engineered to support the latest LGA-4710 (Socket E2) processors, making it a strategic choice for cloud service providers and businesses deploying containerized microservices or edge computing nodes that require the next-generation bandwidth of PCIe 5.0 and DDR5.

Optimized for Heterogeneous Compute Workloads

Flexibility is at the core of the X14SBI-F design. It seamlessly accommodates the full range of Intel Xeon 6 processors, supporting both Efficiency-core (E-core) heavy models for maximum thread density and Performance-core (P-core) variants for raw speed. With a power delivery system robust enough to handle Thermal Design Power (TDP) envelopes of up to 350W, the platform ensures stable operation for high-core-count CPUs (up to 144 cores), providing the computational headroom needed for complex virtualization stacks.

Breaking Bandwidth Barriers with MRDIMM

To prevent memory bottlenecks in AI and data analytics applications, this board integrates eight DDR5 memory slots with advanced signal integrity features. It is one of the few platforms to natively support Multiplexed Rank DIMM (MRDIMM) technology, capable of reaching transfer rates up to 8000 MT/s. For traditional deployments, it also accepts standard ECC RDIMM/3DS RDIMM modules up to 2TB capacity at speeds of 6400 MT/s. This allows system integrators to tune the memory subsystem precisely for low latency or massive capacity.

Cabled PCIe 5.0 Architecture (MCIO)

The X14SBI-F moves away from legacy board layouts by emphasizing cabled connectivity for high-speed I/O. It features six onboard MCIO headers (PCIe 5.0 x8), allowing NVMe SSDs to be connected directly to the motherboard without the signal loss associated with traditional riser cards or traces. In addition to these headers, the board offers physical slots—three PCIe 5.0 x16 and three PCIe 5.0 x8—providing immense flexibility for installing accelerators, FPGAs, or next-gen networking interfaces.

Storage and Utility Connectivity

While focused on NVMe performance, the platform ensures backward compatibility for diverse storage needs. An ASMedia ASM1164 controller drives four SATA 6Gb/s ports via SlimSAS, ideal for localized backup or boot drives. Additionally, dual M.2 PCIe 5.0 x2 slots offer a dedicated space for hypervisors, keeping the main drive bays free for data. Network traffic is managed by two efficient Intel I210 Gigabit Ethernet ports, serving as reliable utility uplinks.

Server-Grade Reliability and Management

Remote fleet management is handled by the industry-standard ASPEED AST2600 BMC. This chip enables secure, out-of-band access via IPMI 2.0 and KVM-over-IP, allowing administrators to troubleshoot OS issues or update firmware remotely. Hardware security is fortified by an integrated TPM 2.0 module, ensuring a trusted boot process and compliance with stringent enterprise security protocols.

Ideal Deployment Environments

  • High-Density Virtualization: Leveraging MRDIMM speed and Xeon 6 core counts for maximum VM allocation.
  • All-Flash Storage Arrays: Utilizing MCIO connectors for direct-attached Gen5 NVMe performance.
  • Edge Inference: A compact platform combining powerful compute with flexible PCIe expansion.

Technical Snapshot

  • Processor Ecosystem: LGA-4710 / Intel Xeon 6 (Up to 144 Cores / 350W)
  • Memory Technology: 8 DIMMs, supports DDR5 MRDIMM (8000 MT/s) & RDIMM
  • Next-Gen I/O: 6x MCIO headers (PCIe Gen5 x8) for cabled devices
  • Expansion Slots: 3x PCIe Gen5 x16 + 3x PCIe Gen5 x8
  • Storage Interfaces: 2x M.2 Gen5, 4x SATA via SlimSAS
  • Networking: Dual 1GbE (Intel I210) + Dedicated IPMI LAN
  • Form Factor: Proprietary WIO-style (12.3″ x 10.5″)

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Payment & Shipping methods

Fast and reliable delivery across the European Union
Estimated transit time: 14–21 days from order confirmation. Worldwide shipping is available for customers outside the EU.
All orders are processed within 24 hours after confirmation. Tracking information is provided as soon as the parcel leaves our logistics center.

Multiple Secure Payment Methods
We accept: Visa, MasterCard, PayPal, Bank Transfer, Klarna, Stripe, Revolut Pay, Google Pay, Apple Pay, and USDT (TRC20) cryptocurrency payments.
All transactions are encrypted and processed via certified payment gateways for your security.

Additional Notes

  • Delivery times may vary depending on customs clearance and carrier schedules.
  • Large or custom-built items may require additional handling time.
  • Shipments are insured until delivered to the customer.
  • We do not deliver to P.O. boxes or military addresses.

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